Talking with Synopsys about the Physics of Chip Design at DAC 2026

Hello you fine Internet folks,I did an audio interview with Ravi Subramanian from Synopsys where we talked about the physics that goes into chip design and EDA tools.Ravi SubramanianHope y’all enjoy!The transcript below has been edited for conciseness and readability.George Cozma: At AMD’s Advancing AI was last week, you guys made some announcements there about 3DIC, and I would just like to learn a little bit more about that and hear a bit more about how you guys are thinking about thermals, but not just thermals, things like current such how to carry current from package to the compute dies?Ravi Subramanian: So maybe a good starting point is the two main trends going on in computing from a pure silicon perspective, chips are getting bigger and bigger to the point where we have some reticle-limited chips. So we see that companies are using 2.5D and 3D types of integration techniques to have multi-die solutions to handle the ever-increasing compute complexity.Thermals have always been…